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1 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b datasheet subject to change without notice. primary applications product description key features measured performance 3 watt c-band packaged power amplifier the triquint TGA2701-SM is a packaged 35dbm power amplifier for c-band applications. the TGA2701-SM provides a nominal 35 dbm of output power at an input power level of 22 dbm with a small signal gain of 18 db. nominal toi is 42 dbm and noise figure is 7.5 db. the TGA2701-SM is a qfn 6x6 mm surface mount package. it is ideally suited for low cost emerging markets such as point to point radio and communications. lead-free & rohs compliant. ? frequency range: 5.9 ? 8.5 ghz ? power: 35 dbm psat, 34 dbm p1db ? gain: 18 db ? toi: 42 dbm ? pae: 37% ? nf: 7.5 db ? bias: vd = 6 v, id = 1.0 a, vg = -0.6 v typical ? package dimensions: 6 x 6 x 0.85 mm ? point-to-point radio ? communications bias conditions: vd = 6 v, id = 1.0 a, vg = -0.6 v typical www.datasheet.net/ datasheet pdf - http://www..co.kr/
2 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b table i absolute maximum ratings 1/ symbol parameter value notes vd-vg drain to gate voltage 9.2 v vd drain voltage 8 v 2/ vg gate voltage range -1.2 to +0.5 v id drain current 3.85 a 2/ ig gate current range -14 to 126ma pin input continuous wave power 29 dbm tchannel channel temperature 200 oc 2/ table ii recommended operating conditions symbol parameter 1/ value vd drain voltage 6 v idq drain current 1.0 a id_drive drain current under rf drive 1.6 a vg gate voltage -0.6 v 1/ see assembly diagram for bias instructions. 1 / these ratings represent the maximum operable val ues for this device. stresses beyond those listed under ?absolute maximum ratings? may cause per manent damage to the device and / or affect device lifetime. these are stress ratings only, and functional operation of the device at these conditions is not implied. 2 / combinations of supply voltage, supply current, input power, and output power shall not exceed the maximum power dissipation listed in table iv. www.datasheet.net/ datasheet pdf - http://www..co.kr/
3 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b symbol parameter test conditions nominal units gain small signal gain f = 5.9 ? 8.5 ghz 18 db irl input return loss f = 5.9 ? 8.5 ghz -10 db orl output return loss f = 5.9 ? 8.5 ghz -10 db psat saturated output power f = 5.9 ? 8.5 ghz 35 dbm p1db output power @ 1db compression f = 5.9 ? 8.5 ghz 34 dbm toi output toi f = 5.9 ? 8.5 ghz 42 dbm nf noise figure f = 5.9 ? 8.5 ghz 7.5 db gain temperature coefficient f = 5.9 ? 8.5 ghz -0.03 db/c power temperature coefficient f = 5.9 ? 8.5 ghz -0.01 dbm/c table iii rf characterization table bias: vd = 6 v, id = 1. 0 a, vg = -0.6 v typical www.datasheet.net/ datasheet pdf - http://www..co.kr/
4 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b parameter test conditions value maximum power dissipation tbaseplate = 85 c pd = 18.5 w tchannel = 200 c thermal resistance, jc vd = 6 v id = 1a pd = 6 w tbaseplate = 85 oc jc = 6.2 c/w tchannel = 122 c tm = 1.3e+7hrs thermal resistance, jc under rf drive vd = 6 v id = 1.6 a pout = 35.5 dbm pd = 6 w tbaseplate = 85 oc jc = 6.2 c/w tchannel = 122 c tm = 1.3e+7 hrs mounting temperature refer to solder reflow profiles (pg 16) storage temperature -65 to 150 c table iv power dissipation and thermal properties median lifetime (tm) vs. channel temperature www.datasheet.net/ datasheet pdf - http://www..co.kr/
5 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b bias conditions: vd = 6 v, id = 1000 ma, vg = -0.6 v typical measured data www.datasheet.net/ datasheet pdf - http://www..co.kr/
6 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b measured data bias conditions: vd = 6 v, id = 1000 ma, vg = -0.6 v typical www.datasheet.net/ datasheet pdf - http://www..co.kr/
7 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b measured data bias conditions: vd = 6 v, id = 1000 ma, vg = -0.6 v typical www.datasheet.net/ datasheet pdf - http://www..co.kr/
8 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b measured data bias conditions: vd = 6 v, id = 1000 ma, vg = -0.6 v typical www.datasheet.net/ datasheet pdf - http://www..co.kr/
9 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b measured data bias conditions: vd = 6 v, id = 1000 ma, vg = -0.6 v typical www.datasheet.net/ datasheet pdf - http://www..co.kr/
10 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b measured data bias conditions: varies www.datasheet.net/ datasheet pdf - http://www..co.kr/
11 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b measured data bias conditions: varies www.datasheet.net/ datasheet pdf - http://www..co.kr/
12 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b electrical schematic rf output rf input TGA2701-SM vg bottom vd1 top vd2 bottom vg top vd2 top vd1 bottom 4 27 9 18 13 23 11 25 bias procedures bias-up procedure bias-down procedure vg (combined vg_top & vg_bottom) set to -1.2 v turn off rf supply vd (combined all four vd) set to +6 v reduce vg to -1.2 v. ensure id ~ 0 ma adjust vg more positive until idq is 1 a. this will be ~ vg = -0.6 v turn vd to 0 v www.datasheet.net/ datasheet pdf - http://www..co.kr/
13 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b pin description 4 rf input 9 vg_bottom 11 vd1_bottom 13 vd2_bottom 18 rf output 23 vd2_top 25 vd1_top 27 vg_top 29 ground 1, 2, 3, 5, 6, 7, 8, 10, 12, 14, 15, 16, 17, 19, 20, 21, 22, 24, 26, 28 nc package pinout pin #1 dot www.datasheet.net/ datasheet pdf - http://www..co.kr/
14 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b gaas mmic devices are susceptible to damage from electrostatic discharge . proper precautions should be observed during handling, assembly and test. mechanical drawing units: millimeters units: millimeters pkg x, y, z size tolerance: +/- 0.050 www.datasheet.net/ datasheet pdf - http://www..co.kr/
15 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b c1 c2 c3 r1 rf input rf output vd 6v 1a vg -0.6v typical c4 c5 c6 r2 r3 r4 part description c1, c2, c3, c4 1000 pf capacitor (0402) c5, c6 1 uf capacitor (0805) r1, r2, r3, r4 0 ohm resistor jumper (0402) gaas mmic devices are susceptible to damage from electrostatic discharge . proper precautions should be observed during handling, assembly and test. recommended assembly board board is 8mil thick ro4003 with 1oz copper cladding. board is mounted on metal block and adequate heatsinking with fan is required. www.datasheet.net/ datasheet pdf - http://www..co.kr/
16 TGA2701-SM triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com april 2012 ? rev b gaas mmic devices are susceptible to damage from electrostatic discharge . proper precautions should be observed during handling, assembly and test. assembly notes recommended surface mount package assembly ? proper esd precautions must be followed while handling packages. ? clean the board with acetone. rinse with alc ohol. allow the circuit to fully dry. ? triquint recommends using a conductive solder pas te for attachment. follow solder paste and reflow oven vendors? recommendations when dev eloping a solder reflow profile. typical solder reflow profiles are listed in the table below. ? hand soldering is not recommended. solder paste can be applied using a stencil printer or dot placement. the volume of solder paste depends on pcb and component layout and should be well controlled to ensure consistent me chanical and electrical performance. ? clean the assembly with alcohol. typical solder reflow profiles reflow profile snpb pb free ramp-up rate 3 c/sec 3 c/sec activation time and temperature 60 ? 120 sec @ 140 ? 160 c 60 ? 180 sec @ 150 ? 200 c time above melting point 60 ? 150 sec 60 ? 150 sec max peak temperature 240 c 260 c time within 5 c of peak temperature 10 ? 20 sec 10 ? 20 sec ramp-down rate 4 ? 6 c/sec 4 ? 6 c/sec ordering information part package style TGA2701-SM qfn 6x6 surface mount www.datasheet.net/ datasheet pdf - http://www..co.kr/

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